Введите слово или словосочетание на любом языке 👆
Язык:
Перевод и анализ слов искусственным интеллектом ChatGPT
На этой странице Вы можете получить подробный анализ слова или словосочетания, произведенный с помощью лучшей на сегодняшний день технологии искусственного интеллекта:
- как употребляется слово
- частота употребления
- используется оно чаще в устной или письменной речи
- варианты перевода слова
- примеры употребления (несколько фраз с переводом)
- этимология
Что (кто) такое wafer - определение
THIN TYPE OF BISCUIT
Wafers; Vanilla wafer; Wafer (cooking); Oblande; Wafer cookie; Freska; Pink Wafer; Waffer; Waferer; Waferers; Waffers; Pink Panther wafers
![Pink 'n' Whites ([[marshmallow]] sandwiched in wafers)](https://commons.wikimedia.org/wiki/Special:FilePath/Pink Wafers.jpg?width=200 "Pink 'n' Whites ([[marshmallow]] sandwiched in wafers)")
Найдено результатов: 57
wafer
(wafers)
1.
A wafer is a thin crisp biscuit which is usually eaten with ice cream.
N-COUNT
2.
A wafer is a circular, thin piece of special bread which the priest gives people to eat in the Christian service of Holy Communion.
N-COUNT
Wafer
·vt To seal or close with a wafer.
II. Wafer ·noun A thin cake made of flour and other ingredients.
III. Wafer ·noun An adhesive disk of dried paste, made of flour, gelatin, isinglass, or the like, and coloring matter, - used in sealing letters and other documents.
IV. Wafer ·noun A thin cake or piece of bread (commonly unleavened, circular, and stamped with a crucifix or with the sacred monogram) used in the Eucharist, as in the Roman Catholic Church.
wafer
¦ noun
1. a thin, light, crisp sweet biscuit.
2. a thin disc of unleavened bread used in the Eucharist.
3. a disc of red paper stuck on a legal document as a seal.
historical a small disc of dried paste formerly used for fastening letters or holding papers together.
4. Electronics a very thin slice of a semiconductor crystal used as the substrate for solid-state circuitry.
Derivatives
wafery adjective
Origin
Wafer
A wafer is a crisp, often sweet, very thin, flat, light and dry biscuit, often used to decorate ice cream, and also used as a garnish on some sweet dishes. Wafers can also be made into cookies with cream flavoring sandwiched between them.
Waferer
·noun A dealer in the cakes called wafers; a confectioner.
Wafer testing
STEP PERFORMED DURING SEMICONDUCTOR DEVICE FABRICATION BY APPLYING SPECIAL TEST PATTERNS TO A WAFER BEFORE IT IS SENT TO DIE PREPARATION
Wafer sort; Wafer prober
Wafer testing is a step performed during semiconductor device fabrication after BEOL process is finished. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test patterns to them.
Wafer bonding
PACKAGING TECHNOLOGY ON WAFER-LEVEL FOR THE FABRICATION OF MICROELECTROMECHANICAL SYSTEMS ETC., ENSURING A MECHANICALLY STABLE AND HERMETICALLY SEALED ENCAPSULATION
User:Enaswiki/Wafer bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices.
Wafer fabrication
TERM
Wafer Fabrication
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.
Wafer dicing
THE PROCESS BY WHICH DIE ARE SEPARATED FROM A WAFER OF SEMICONDUCTOR FOLLOWING THE PROCESSING OF THE WAFER
Wafer sawing
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting.
Wafer backgrinding
Backlap; Wafer thinning
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC).
Википедия
Wafer
A wafer is a crisp, often sweet, very thin, flat, light biscuit, often used to decorate ice cream, and also used as a garnish on some sweet dishes. Wafers can also be made into cookies with cream flavoring sandwiched between them (e.g., Oreo). They frequently have a waffle surface pattern but may also be patterned with insignia of the food's manufacturer or may be patternless. Some chocolate bars, such as Kit Kat and Coffee Crisp, are wafers with chocolate in and around them.
